Molding 0603 side view
RT-170ET_V1 0
Product Features
* Protective encapsulation technique
* Enhanced durability and environmental resilience
* 140°
* Customization for different package size
Application：
Optical switch
Optical fiber communication
Remote control
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- Product Specifications
- Product Description
The LED Infrared packaged in molding employs a protective encapsulation technique for enhanced durability and environmental resilience. This molded packaging ensures reliability in diverse applications like remote controls and security systems. The process provides effective thermal management, contributing to stable performance in infrared LED applications for efficient light emission.
